- All sections
- H - Electricity
- H01R - Electrically-conductive connections; structural associations of a plurality of mutually-insulated electrical connecting elements; coupling devices; current collectors
- H01R 13/6466 - Means for preventing cross-talk by adding capacitive elements on substrates, e.g. printed circuit boards [PCB]
Patent holdings for IPC class H01R 13/6466
Total number of patents in this class: 172
10-year publication summary
|
17
|
34
|
25
|
35
|
18
|
10
|
4
|
8
|
5
|
0
|
| 2015 | 2016 | 2017 | 2018 | 2019 | 2020 | 2021 | 2022 | 2023 | 2024 |
Principal owners for this class
| Owner |
All patents
|
This class
|
|---|---|---|
| Panduit Corp. | 1007 |
35 |
| CommScope, Inc. of North Carolina | 647 |
24 |
| CommScope Technologies LLC | 4937 |
17 |
| Foxconn Interconnect Technology Limited | 1034 |
7 |
| Sentinel Connector Systems, Inc. | 41 |
7 |
| Bel Fuse (Macao Commercial Offshore) Limited | 39 |
5 |
| Belden Canada ULC | 134 |
3 |
| Apple Inc. | 50209 |
2 |
| Sumitomo Wiring Systems, Ltd. | 9367 |
2 |
| Hubbell Incorporated | 3052 |
2 |
| Amphenol Corporation | 748 |
2 |
| Reichle & De-Massari AG | 65 |
2 |
| Sejong Ind. Co., Ltd. | 16 |
2 |
| TE Connectivity AMP Espana S.L.U. | 12 |
2 |
| TE Connectivity Germany GmbH | 655 |
2 |
| Amphenol FCI Asia Pte. Ltd. | 191 |
2 |
| North Mill Capital LLC | 18 |
2 |
| Bison Patent Licensing, LLC | 184 |
2 |
| Samsung Electronics Co., Ltd. | 131630 |
1 |
| 3m Innovative Properties Company | 18406 |
1 |
| Other owners | 50 |